Halogen free typeCompatible with halogen free standards, while achieving the same level of solderability as the conventional products.
Performing with excellent solderability equivalent to the standard products that are not halogen free, while achieving such high level of reliability as meeting halogen free standards (chlorine(Cl): ≤900 ppm, bromine (Br): ≤900 ppm, Chlorine (Cl) and Bromine (Br): ≤1,500 ppm).
Mount a 2010 chip after printing solder paste onto a printed board with a thickness of 120 μｍ.
Preheat at 160 to 190°C, reflow heat for 90 sec at 240°C.
Expanded activation temperature range due to our unique activation agent technology resulted in improved heat resistance.
Print solder paste onto a copper substrate with φ 6.5 mｍ and a thickness of 200 μｍ.
Preheat at 200℃, 3 min
Reflow heat at 240℃
Observe melting conditions