Flux ultra-low spattering typeSignificant reduction in flux spattering.
Also has the feature
of preventing flux residue cracking or peeling off.
Adoption of the special flux, which is viscous itself, contributes to significant reduction in flux spattering during soldering, achieving ultra low flux spattering.
Designed to reduce potential for cracking of flux residue, not just at room temperature, but at high temperatures (85℃) and low temperatures (-15℃). Suitable for soldering bent or movable parts.