LH Lead free solder paste

Halogen free typeCompatible with halogen free standards, while achieving the same level of solderability as the conventional products.

Halogen free, with excellent solderability.

Performing with excellent solderability equivalent to the standard products that are not halogen free, while achieving such high level of reliability as meeting halogen free standards (chlorine(Cl): ≤900 ppm, bromine (Br): ≤900 ppm, Chlorine (Cl) and Bromine (Br): ≤1,500 ppm).

  • FLF01-LH
  • Equivalent LH products from other manufacturers.
  • Standard products

Mount a 2010 chip after printing solder paste onto a printed board with a thickness of 120 μm.

Preheat at 160 to 190°C, reflow heat for 90 sec at 240°C.

Observe solderability

Excellent heat resistance

Expanded activation temperature range due to our unique activation agent technology resulted in improved heat resistance.

  • FLF01-LH
  • Equivalent LH products from other manufacturers.
  • Standard products

Print solder paste onto a copper substrate with φ 6.5 mm and a thickness of 200 μm.

Preheat at 200℃, 3 min

Reflow heat at 240℃

Observe melting conditions

Please feel free to contact us for general enquiries or questions and concerns related to products.
046-274-0706
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